Material Removal Mechanism and Evolution of Subsurface Defects during Nanocutting of Monocrystalline Cu

Figure 10

The evolution of prismatic dislocation loop at the cutting distances of (a) 4.4 nm, (b) 6.6 nm, (c) 7 nm, (d) 8.6 nm, (e) 8.8 nm, (f) 9.0 nm, (g) 9.2 nm, (h) 9.4 nm, (i) 10 nm, and (j) 12 nm.

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