Coupled Effect of Curing Temperature and Moisture on THM Behavior of Cemented Paste Backfill

Table 2

Parameters and conditions used for model verification.

Parameters and conditions	Values
Curing temperature (°C)	30; 30; 10; 10; 20; 20
Curing age (d)	28
Curing humidity (%)	70; 70; 45; 95; 95; 95
Thermal conductivity of the solid matrix (W/(m·K))	3.15
Initial porosity of the CPB samples	0.45
Specific heat of the solid matrix (J/(kg·K))	1300
Density of the solid matrix (kg/m^3)	2200
Density of liquid water (kg/m^3)	1000
Specific heat of liquid water (J/(kg·K))	4200
Initial temperature of the CPB samples (°C)	30; 30; 10; 10; 20; 20
Initial humidity of the CPB samples (%)	100
Initial displacement field (m)	0
Initial structural velocity field (m/s)	0
Top surface	Confined deformation
Lateral sides	Free
Bottom side	Fixed
Volume force	Gravity