Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling

<table class="table-group" id="tab3"><tr><td><table class="table"><tr><td class="thead-hr" colspan="4"><hr/></td></tr><tr class="thead"><td class="align_left">Methods</td><td class="align_center">C<sub>TSV-equiv</sub> (fF)</td><td class="align_center">R<sub>sub-equiv</sub> (Ω)</td><td class="align_center">C<sub>sub-equiv</sub> (fF)</td></tr><tr><td class="thead-hr" colspan="4"><hr/></td></tr><tr><td class="align_left">GAs</td><td class="align_center">815.21</td><td class="align_center">870.74</td><td class="align_center">14.08</td></tr><tr><td class="align_left">PSO</td><td class="align_center">808.13</td><td class="align_center">880.13</td><td class="align_center">13.93</td></tr><tr><td class="align_left">3D-TLM</td><td class="align_center">817.5</td><td class="align_center">879.8</td><td class="align_center">12</td></tr><tr class="table-tr"><td colspan="4"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>The TSV-contact noise coupling parameters using GA and 3D-TLM.</div>

Applied Computational Intelligence and Soft Computing

tab3

Table 3

Table 3: Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling 