Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films

Figure 1

3D surface topographies of the Cu films: (a) 1.0 μm thick, as-deposited; (b) 1.0 μm thick, annealed at 300°C; (c) 1.6 μm thick, as-deposited; (d) 1.6 μm thick, annealed at 300°C; (e) 3.0 μm thick, as-deposited; and (f) 3.0 μm thick, annealed at 300°C.

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