Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition

<div>Validation of the global model and comparison of results for Al and Cu. (a) Electron temperature and (b) metal atoms ionization degree versus total average density of metal atoms in the chamber.</div>

Advances in Materials Science and Engineering

fig2

Figure 2

Figure 2: Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition 