Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition

<div>Penetration of sheath into the trench for different values of RF power and substrate bias. For each case two contours are plotted: <svg height="11.927pt" id="M66" style="vertical-align:-3.291101pt" version="1.1" viewbox="-0.0498162 -8.6359 55.1014 11.927" width="55.1014pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M241 635C89 635 35 457 35 312C35 153 89 -12 240 -12C390 -12 443 166 443 312C443 466 390 635 241 635ZM238 602C329 602 354 454 354 312C354 172 330 22 240 22C152 22 124 173 124 313S148 602 238 602Z" id="g113-49"></path></g><g transform="matrix(.013,0,0,-0.013,6.24,0)"><path d="M113 -12C146 -12 170 11 170 46C170 78 146 103 114 103S58 78 58 46C58 11 82 -12 113 -12Z" id="g113-47"></path></g><g transform="matrix(.013,0,0,-0.013,9.204,0)"><path d="M244 635C114 635 38 519 38 422C38 317 111 240 217 240C236 240 255 244 277 256L345 292C311 140 203 39 59 15L64 -15C89 -15 150 -5 204 17C339 72 440 202 440 386C440 521 368 635 244 635ZM228 602C326 602 352 479 352 390C352 370 351 347 348 324C327 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612 199 616 278 622L284 650H29L23 622C105 616 109 609 94 532L48 291C23 160 51 83 98 40C143 -1 202 -16 260 -16C321 -16 387 3 439 49C509 111 542 204 563 312L577 384C595 479 608 533 619 569C629 603 637 620 709 622L715 650Z" id="g113-86"></path></g><g transform="matrix(.0091,0,0,-0.0091,49.974,3.132)"><path d="M460 334C460 396 434 451 378 451C330 451 241 408 148 300H146L237 679C241 697 241 710 232 710C213 710 153 684 67 675L66 646H95C141 646 145 642 134 595L39 170C23 97 31 54 46 33C64 8 100 -12 137 -12C178 -12 234 3 298 43C391 101 460 222 460 334ZM371 320C371 204 316 89 248 51C230 41 208 37 192 37C143 37 102 72 119 166C124 194 129 215 135 235C202 323 298 392 335 392C353 392 371 372 371 320Z" id="g50-99"></path></g></svg>.</span> (a) <svg height="11.927pt" id="M68" style="vertical-align:-3.291101pt" version="1.1" viewbox="-0.0498162 -8.6359 48.7118 11.927" width="48.7118pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g 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Advances in Materials Science and Engineering

fig3

Figure 3

Figure 3: Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition 