Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition

<div>Ratio of flux to the bottom and flux to planar substrate of (a) Cu<sup>+</sup> and (b) Ar<sup>+</sup> ions under the whole range of studied conditions. <svg height="11.8174pt" id="M74" style="vertical-align:-3.1815pt" version="1.1" viewbox="-0.0498162 -8.6359 17.4972 11.8174" width="17.4972pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M488 658H270V630C328 626 335 619 335 579C217 574 44 509 44 330C44 147 221 88 335 86C335 38 328 32 265 28V0H488V28C425 32 418 38 418 86C534 88 710 153 710 337C710 517 538 575 418 579C418 619 425 626 488 630V658ZM335 118C249 124 136 180 136 337C136 490 251 543 335 547V118ZM418 547C502 543 618 491 618 333S503 124 418 118V547Z" id="g113-150"></path></g><g transform="matrix(.0091,0,0,-0.0091,9.802,3.132)"><path d="M782 650H541L536 618L564 614C597 609 604 600 584 574C535 508 486 451 437 395C394 473 361 533 343 575C331 605 335 610 375 615L400 618L407 650H156L147 618C222 612 230 608 267 537L375 330C277 214 186 117 163 96C108 43 97 38 27 32L18 0H265L274 32L251 35C204 41 202 47 224 80C264 138 327 213 397 293L504 80C520 48 516 42 472 36L440 32L433 0H707L716 32C627 38 622 43 581 121L455 361L629 548C685 606 696 610 775 618L782 650Z" id="g50-89"></path></g></svg> means flux of particles <svg height="8.68572pt" id="M75" style="vertical-align:-0.0498209pt" version="1.1" viewbox="-0.0498162 -8.6359 10.0819 8.68572" width="10.0819pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M748 650H522L515 622L546 617C580 611 587 604 565 575C518 513 469 451 419 393C376 474 349 534 330 580C318 609 325 612 361 618L383 622L392 650H151L144 622C214 616 224 612 257 543L360 327C270 218 187 124 159 95C106 40 92 34 26 28L17 0H252L259 28L236 31C189 37 188 47 209 78C249 136 308 210 377 294L478 79C494 44 487 37 449 32L418 28L409 0H673L680 28C596 34 591 39 554 116L436 361C526 469 574 521 604 553C659 612 669 614 739 622L748 650Z" id="g113-89"></path></g></svg> to the bottom of the trench; <svg height="14.7729pt" id="M76" style="vertical-align:-3.181499pt" version="1.1" viewbox="-0.0498162 -11.5914 22.4436 14.7729" width="22.4436pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M488 658H270V630C328 626 335 619 335 579C217 574 44 509 44 330C44 147 221 88 335 86C335 38 328 32 265 28V0H488V28C425 32 418 38 418 86C534 88 710 153 710 337C710 517 538 575 418 579C418 619 425 626 488 630V658ZM335 118C249 124 136 180 136 337C136 490 251 543 335 547V118ZM418 547C502 543 618 491 618 333S503 124 418 118V547Z" id="g113-150"></path></g><g transform="matrix(.0091,0,0,-0.0091,9.802,-5.741)"><path d="M245 635C92 635 37 457 37 312C37 149 91 -12 244 -12C395 -12 449 166 449 312C449 469 395 635 245 635ZM243 598C332 598 358 454 358 312C358 173 334 26 245 26C158 26 128 174 128 313S152 598 243 598Z" id="g50-49"></path></g><g transform="matrix(.0091,0,0,-0.0091,14.785,3.132)"><path d="M782 650H541L536 618L564 614C597 609 604 600 584 574C535 508 486 451 437 395C394 473 361 533 343 575C331 605 335 610 375 615L400 618L407 650H156L147 618C222 612 230 608 267 537L375 330C277 214 186 117 163 96C108 43 97 38 27 32L18 0H265L274 32L251 35C204 41 202 47 224 80C264 138 327 213 397 293L504 80C520 48 516 42 472 36L440 32L433 0H707L716 32C627 38 622 43 581 121L455 361L629 548C685 606 696 610 775 618L782 650Z" id="g50-89"></path></g></svg> means flux of particles <svg height="8.68572pt" id="M77" style="vertical-align:-0.0498209pt" version="1.1" viewbox="-0.0498162 -8.6359 10.0819 8.68572" width="10.0819pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M748 650H522L515 622L546 617C580 611 587 604 565 575C518 513 469 451 419 393C376 474 349 534 330 580C318 609 325 612 361 618L383 622L392 650H151L144 622C214 616 224 612 257 543L360 327C270 218 187 124 159 95C106 40 92 34 26 28L17 0H252L259 28L236 31C189 37 188 47 209 78C249 136 308 210 377 294L478 79C494 44 487 37 449 32L418 28L409 0H673L680 28C596 34 591 39 554 116L436 361C526 469 574 521 604 553C659 612 669 614 739 622L748 650Z" id="g113-89"></path></g></svg> to a planar substrate without trench.</div>

Advances in Materials Science and Engineering

fig5

Figure 5

Figure 5: Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition 