Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition

Figure 6

Flux of (a) Cu⁺ and (b) Ar⁺ ions along the trench boundary for different biases. RF power  W. means flux of particles along the trench; is a constant that describes flux of particles to a planar substrate without trench. Coordinate starts on the edge of the domain (0 mm), reaches the beginning of the trench (2.4 mm), then the bottom (4.4 mm), goes along the bottom (4.4–4.6 mm), then along the side (4.6–6.6 mm), and continues on remaining planar part of substrate (6.6–9 mm).

(a)

(b)