Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging

Figure 4

Thickness and voids of die-attach layer with different bonding pressure: (a) 0 N, (b) 0.3 N, (c) 0.6 N, (d) 1.2 N, and (e) 2 N.

(a)

(b)

(c)

(d)

(e)