Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging

Table 1

Void fraction of die-attach layer under different bonding pressure.

Pressure of bonding (N)	Void fraction (%)	Thickness of die-attach; layer (m)	Volume of the die-attach; (mm^3)
0	62.45%	38.8	0.0146
0.3	52.60%	29	0.0137
0.6	39.67%	16.7	0.0101
1.2	29.76%	14.6	0.0103
2	16.53%	8.4	0.007