Effects of Die-Attach Quality on the Mechanical and Thermal Properties of High-Power Light-Emitting Diodes Packaging

Table 3

Composition and thermal parameter of LED modules.

Composition	Chip	Die-attach layer	Al	Copper	Lens
Thermal conductivity (W/mK)	180	51	236	385	0.3
Thickness (mm)	0.16	0.02	1	0.07
Coefficient of thermal expansion (10^−6°C^−1)	7.5	25	23	16.4	8
Young’s modules (GPa)	410	26	71.7	110	55
Poisson’s ratio	0.14	0.365	0.33	0.34	0.25