Journals
Publish with us
Publishing partnerships
About us
Blog
Advances in Materials Science and Engineering
Journal overview
For authors
For reviewers
For editors
Table of Contents
Special Issues
Advances in Materials Science and Engineering
/
2020
/
Article
/
Fig 8
/
Research Article
Properties of Sn-Ag-Cu Solder Joints Prepared by Induction Heating
Figure 8
Ultimate tensile strength of soldered joints, prefix R, reflow soldered by hot plate and I, soldered by induction heating.
