Properties of Sn-Ag-Cu Solder Joints Prepared by Induction Heating

Table 1

Measured concentrations of Ag, Cu, and Sn in the solder alloys.

Alloy	Component (wt.%)
	Ag	Cu	Sn
SAC357	3.26 ± 0.08	0.73 ± 0.06	Bal.
SAC158	1.52 ± 0.08	0.82 ± 0.09	Bal.
SAC108	1.06 ± 0.11	0.90 ± 0.08	Bal.
SAC037	0.31 ± 0.11	0.70 ± 0.10	Bal.