Research Article

Properties of Sn-Ag-Cu Solder Joints Prepared by Induction Heating

Table 2

Comparative table of the selected findings.

AlloyMelting temperature (° C)Heat of fusion (J g−1)Electrical resistivity of the joints (10−6 Ω m)Ultimate tensile strength of the joints (MPa)
Reflow solderedInduction solderedReflow solderedInduction soldered

SAC357217.446.01.6 ± 0.42.5 ± 0.892.4 ± 4.499.8 ± 2.5
SAC158217.6 ÷ 222.854.71.4 ± 0.73.1 ± 0.658.0 ± 4.570.8 ± 4.2
SAC108217.5 ÷ 224.454.61.8 ± 0.82.6 ± 1.056.2 ± 4.672.0 ± 7.7
SAC037217.4 ÷ 227.964.42.2 ± 1.13.0 ± 0.955.2 ± 1.652.0 ± 3.6