Study on Safety Performance of Building Finish Layer under Thermomechanical Coupling Condition

Figure 21

Normal bond stress distribution of the semirigid finish layer (unit: MPa). (a) Insulation layer (without temperature). (b) Insulation layer (50°C). (c) Insulation layer (–20°C). (d) Interface layer (without temperature). (e) Interface layer (50°C). (f) Interface layer (−20°C).

(a)

(b)

(c)

(d)

(e)

(f)