Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper

<div>Fractography of a ZnO/Cu joint with Sn<sub>8</sub>Zn<sub>3</sub>Bi<sub>1</sub>Mg active solder after shear tests at room temperature: (a) the Cu side; (b) the ZnO side.</div>

Advances in Materials Science and Engineering

fig9

Figure 9

Figure 9: Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper 