[Retracted] Investigation of Insulation Properties Using Microwave Nondevastating Methodology to Predict the Strength of Polymer Materials

Table 3

Bonding strength.

No	Temperature (°C)	Bond strength (MPa)	Avg. bond strength (MPa)
1–3	0	0.43	0.49
		0.57
	0	0.48	0.5
		0.39
13–15	0	0.45	0.72
		0.10
		0.30
25–27	0	0.65	0.20
		1.13
		0.28
37–39		0.2
		0.11