Study on the Thermal Conductivity of Cu/Al Joints with Different Interfacial Microstructures

<div>The interfacial thermal resistance model of the joint prepared by FSW. (a) The interfacial region and thermal resistance model and (b) interfacial thermal conductivity varying with the thickness of the IMCs.</div>

Advances in Materials Science and Engineering

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Figure 10

Figure 10: Study on the Thermal Conductivity of Cu/Al Joints with Different Interfacial Microstructures 