Study on the Thermal Conductivity of Cu/Al Joints with Different Interfacial Microstructures

<div>The interfacial thermal resistance model of the joint prepared by EW. (a) The interfacial region and thermal resistance model and (b) interfacial thermal conductivity varies with the thickness of the IMCs.</div>

Advances in Materials Science and Engineering

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Figure 11

Figure 11: Study on the Thermal Conductivity of Cu/Al Joints with Different Interfacial Microstructures 