Study on the Thermal Conductivity of Cu/Al Joints with Different Interfacial Microstructures

Table 1

Composition and properties of 1060 Al and T2 Cu base metals used in this paper.

Base metal	Composition (mass %)	Melting point (°C)	Coefficient of linear expansion (10^−6K^−1)	Heat conductivity/W(m·K)^−1	Tensile strength (MPa)	Resistivity (10^−9Ω·m)
1060 Al	Al ≥ 99.6%	1083	16.5	394.0	83∼91	27.6∼29.1
T2 Cu	Cu ≥ 99.9%	660	23.6	222.0	293∼300	17.1∼18.5