Fractography and Microstructural Analysis of As-Built and Stress Relieved DMLS Ti6Al4V (ELI) Plates Subjected to High Velocity Impact

<div>SEM SEI micrographs (a) of the penetration hole through a 10 mm thick plate and (b and c) higher magnification micrographs of the circled areas in (a) at the entry and exit of the projectile hole in (b), respectively.</div>

Advances in Materials Science and Engineering

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Figure 12

Figure 12: Fractography and Microstructural Analysis of As-Built and Stress Relieved DMLS Ti6Al4V (ELI) Plates Subjected to High Velocity Impact 