Microstructure, Mechanical, and Nanotribological Properties of Ni, Ni-TiN, and Ni₉₀Cu₁₀-TiN Films Processed by Reactive Magnetron Cosputtering

Table 1

The deposition parameters for the investigated thin films.

Processing parameters	Values
Base pressure	2.0 × 10^−6 Torr
Working pressure	30 m Torr
Gas ratio (Ar : N2)	1 : 2
RF power for Ti target	300 W
DC power for Ni target	50 W
DC power for Cu target	9 W
Substrate temperature	100°C
Substrate bias	−60 V
Speed for substrate rotation	25 rpm
Substrate to target distance	150 mm