Microstructural Evolution in Nonvacuum Solid-State Diffusion Bonded Joints of AA2219

Figure 16

Bonding formations of the AA2219 joints: (a) Specimens before diffusion bonding, (b) formation of cracks and voids along the interface at 450°C, (c) formation of thin bonding line on the interface at 475°C, and (d) formation of the homogeneous microstructure without bonding line at 500°C.