High-Strength Hollow Glass Microsphere/Epoxy Resin Composite Insulation Materials for Deep In-Situ Condition Preserved Coring

Figure 2

Thermogravimetric (TG) curves of the EP matrixes. The initial thermal decomposition temperatures of E51 EP, AEEA EP, 594 EP, CICG EP, 2E4MI EP, and mPDA EP were 231.0°C, 336.2°C, 368.4°C, 400.5°C, 403.7°C, and 352.2°C, respectively. The ending thermal decomposition temperatures of E51 EP, AEEA EP, 594 EP, CICG EP, 2E4MI EP, and mPDA EP were 459.95°C, 394.5°C, 490.3°C, 441.3°C, 440.5°C, and 392.9°C, respectively.