High-Strength Hollow Glass Microsphere/Epoxy Resin Composite Insulation Materials for Deep In-Situ Condition Preserved Coring

Figure 3

Derivative thermogravimetry (DTG) curves of the EP matrixes. The peak thermal decomposition temperatures of E51 EP, AEEA EP, 594 EP, CICG EP, 2E4MI EP, and mPDA EP were 342.9°C, 360.4°C, 430.16°C, 420.7°C, 424.0°C, and 367.1°C, respectively.