Research Article

High-Strength Hollow Glass Microsphere/Epoxy Resin Composite Insulation Materials for Deep In-Situ Condition Preserved Coring

Table 1

Information on experimental materials.

NamePurityManufacturerMolecular formula

Common industrial curing agent (CICA)Industrial gradeJinghong Polymer Materials Co., Ltd.—
EP E51Industrial gradeNantong Xingchen Synthetic Co., Ltd.
594 boramine curing agent (594)Industrial gradeChina National Bluestar (Group) Co., Ltd.
Methyltetrahydrophthalic anhydrideIndustrial gradeChina National Bluestar (Group) Co., Ltd.
Diethyltetramethylimidazole (2E4MI)Analytical reagentShanghai Macklin Biochemical Co., Ltd.
Hydroxyethyl aminoethylethanolamine (AEEA)Analytical reagentShanghai Macklin Biochemical Co., Ltd.
m-Phenylenediamine (mPDA)Analytical reagentChengdu Kelong Chemicals Co., Ltd.