Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation

Table 3

Specifications of CCGA624 package [18].

Item		Value
Manufacturer		Microsemi Corporation
Configuration
Column	Composition	80Pb/20Sn (with copper ribbon)
	Dimension (mm)	2.21 × 0.51 (height × diameter)
Package	Dimension	32.5 × 32.5 × 2.25
	Number of column pins	624
	Lead pitch (mm)	1.27
Total weight (g)		13.28 (including 2.36 g for solder columns)
JEDEC Registration		JEDEC MO-158 VAR BE-1