Research Article

Fabrication of a Flexible RFID Antenna by Using the Novel Environmentally Friendly Additive Process

Table 2

Comparison table of the process technique, subtraction process (traditional) and additive process, used in this work.

Process stepsThis workOther processThis work’ advantage

Process characteristicsAdditive processSubtraction process using FCCL(i) High material utilization

MaterialFlexible substrateFlexible copper foil substrate(i) Reduced chemical usage
(ii) Low material cost

Photoresist processNoneHave(i) Reduce CO2 emission

Wet processSteps:Three steps:(i) Reduce >80% of consumed water and waste liquid
(1) Screen printing(1) Development
(2) Copper displacement using additives(2) Etching
(3) Photoresist removal

Chemical used in the wet processCuSO4 and H2SO4Development, NaOH
Etching, CuCl2, HCI, NH4Cl
Photoresist removal, NaOH, inhibitor
(i) 80% less chemical used and effort for production, transportation, storage, waste treatment, and less pollutant

Resistance value6∼12 × 10−8 Ωm1.7 × 10−8 ΩmSufficient conductivity for most applications