Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate
Figure 5
SEM images of the Cu/Pd composite electrodeposited on BDD electrode in solutions with different Cu(II) : Pd(II) ratio: (a) (1 : 1), (b) (5 : 1), and (c) 10 : 1. All were deposited applying −0.3 V by 120 s.
