Research Article
A Wideband Transition from Microstrip Line to Microstrip Spoof Surface Plasmon Polariton Line for Microwave/Millimeter-Wave Applications
Table 1
Comparison with previously reported transitions.
| | Type of SSPP | Bandwidth (GHz) | F.B.W. (%) | Transition length | Transition occupation ratio (%) |
| [3] | Groundless SSPP | 22.5-42 | 60.5% | 0.6933 λ | 39.13% | [4] | Groundless SSPP | 4.5-11.5 | 87.5% | 0.933 λ | 48% | [5] | Groundless SSPP | 5-8 | 46.2% | 0.589 λ | 58.9% | [6] | Groundless SSPP | 3.2-5.8 | 27.3% | 2.403 λ | 146.85% | [7] | Groundless SSPP | 6-12 | 66.67% | 1.8 λ | 180% | [8] | Groundless SSPP | 2.2-10 | 63.9% | 0.4473 λ | 57.95% | [15] | Dual metallic strip | 3.1-17.5 | 139.8% | 1.236 λ | 103% | [16] | Grounded SSPP | 0-13 | 200% | 0.1456 λ | 14.56% | [17] | Grounded SSPP | 0.1-8 | 197.5% | 0.567 λ | 56% | [18] | Grounded SSPP | 1-7 | 150% | 0.533 λ | 53.33% | This work (p =1 mm) | Grounded SSPP | 1-40 | 190.24% | 0.3417 λ | 34.18% | This work (p =2 mm) | Grounded SSPP | 1-22 | 182.6% | 0.46 λ | 44% | This work (p =3 mm) | Grounded SSPP | 1-12 | 184.61% | 0.39 λ | 39% |
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