Thermal Characteristic Investigation for a Multichip Module Based on APDL

<div>Curves of maximum thermal stress and thermal deformation with different powers when <span class="nowrap"><svg height="11.0292pt" id="M66" style="vertical-align:-0.2325001pt" version="1.1" viewbox="-0.0498162 -10.7967 48.554 11.0292" width="48.554pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M620 675H597C578 656 570 650 541 650H144C112 650 104 653 94 675H72C59 618 42 552 23 493L53 491C71 534 88 564 105 585C124 608 144 615 238 615H290L197 121C182 40 174 34 88 28L82 0H361L367 28C275 34 266 38 281 121L374 615H441C522 615 543 608 553 583C562 560 566 531 565 493L597 494C603 551 612 629 620 675Z"></path></g><g transform="matrix(.013,0,0,-0.013,11.917,0)"><path d="M535 323V373H52V323H535ZM535 138V188H52V138H535Z"></path></g><g transform="matrix(.013,0,0,-0.013,23.18,0)"><path d="M447 623H65C61 580 56 530 47 475H76C100 541 106 550 172 550H388C308 376 196 170 91 -1L98 -12L172 -2C268 204 360 408 455 611L447 623Z"></path></g><g transform="matrix(.013,0,0,-0.013,29.422,0)"><path d="M241 635C89 635 35 457 35 312C35 153 89 -12 240 -12C390 -12 443 166 443 312C443 466 390 635 241 635ZM238 602C329 602 354 454 354 312C354 172 330 22 240 22C152 22 124 173 124 313S148 602 238 602Z"></path></g><g transform="matrix(.0091,0,0,-0.0091,35.707,-5.741)"><path d="M339 262C339 340 273 403 193 403S48 340 48 262S113 121 193 121S339 184 339 262ZM283 262C283 210 242 168 193 168S104 210 104 262S144 356 193 356S283 314 283 262Z"></path></g><g transform="matrix(.013,0,0,-0.013,39.721,0)"><path d="M614 175C564 76 510 21 408 21C256 21 146 149 146 336C146 488 235 629 402 629C510 629 570 586 597 480L626 488C620 541 614 582 606 638C578 643 510 665 429 665C206 665 44 527 44 316C44 157 153 -15 402 -15C474 -15 558 5 586 11C604 45 629 119 643 165L614 175Z"></path></g></svg>.</span></div>

International Journal of RF and Microwave Computer-Aided Engineering

fig11

Figure 11

Figure 11: Thermal Characteristic Investigation for a Multichip Module Based on APDL 