Research Article
Thermal Characteristic Investigation for a Multichip Module Based on APDL
Table 1
Material attributes for MCM model.
| | Material | Density (g/cm3) | Thermal expansivity (1/°C) | Specific heat (J/kg°C) | Coefficient of heat conduction (W/m°C) | Young’s modulus (MPa) |
| | Cu | 8.92 | | 385 | 401 | | | CCL | 1.93 | | 1280 | 1.2 | | | GaAs | 5.31 | | 360 | 130 | | | Si | 2.33 | | 700 | 149 | | | G700A | 1.99 | | 1064 | 0.96 | 5400 |
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