Research Article
Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs
Table 1
Thermal conductivities and dimensions of packaging components.
| | Packaging components | Materials | Sizes (mm) | Thermal conductivities (W/(m·K)) |
| | Substrate | Al | | 237 | | Insulating layer | —— | | 0.25 | | Circuit layer | Cu | | 401 | | Solder paste | SnAgCu | | 60 | | Chip | Sapphire | | 50 | | Lens | Glass | | 0.21 |
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