High-Density Polyethylene Composites Filled with Nanosilica Containing Immobilized Nanosilver or Nanocopper: Thermal, Mechanical, and Bactericidal Properties and Morphology and Interphase Characterization

<table>Particle size distribution curves of Ag-SiO<sub>2</sub> (a) and Cu-SiO<sub>2</sub> (b); average particle size 30 nm.</table>

International Journal of Polymer Science

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Figure 1

Figure 1: High-Density Polyethylene Composites Filled with Nanosilica Containing Immobilized Nanosilver or Nanocopper: Thermal, Mechanical, and Bactericidal Properties and Morphology and Interphase Characterization 

Figure 1 | High-Density Polyethylene Composites Filled with Nanosilica Containing Immobilized Nanosilver or Nanocopper: Thermal, Mechanical, and Bactericidal Properties and Morphology and Interphase Characterization 