Curing Reaction and Dielectric Properties of Rigid and Elastic Liquid Crystal Epoxy Networks Modified with Nanofillers

<div>Isothermal curing of the epoxy resin at <i>T</i> = 170°C, in the electric modulus representation. Imaginary part of the electric modulus plotted versus time in a wide frequency range: (a) curing with the aromatic amine (DDM); (b) curing with pimelic acid (PA). Insets: modulus evolution with time at one specific frequency, for mixtures cured with and without nanofillers.</div>

International Journal of Polymer Science

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Figure 2

Figure 2: Curing Reaction and Dielectric Properties of Rigid and Elastic Liquid Crystal Epoxy Networks Modified with Nanofillers 