Design and Fabrication of Metallic-Conductive Polymer-Based Hybrid Film Interconnections for Stretchable Electronic Devices

Table 1

Changes in morphology of Ti–Au films under different conditions.

Metal process	Condition	Roughness
Ti–Au (10–50 nm)	O2 plasma 10 s at 80 W	Rq: 17.3 nm
		Ra: 14.4 nm
Ti–Au (10–50 nm)	O2 plasma 30 s at 80 W	Rq: 10.7 nm
		Ra: 8.9 nm
Ti–Au (10–50 nm)	O2 plasma 60 s at 80 W	Rq:2.21 nm
		Ra: 1.75 nm