Design and Fabrication of Metallic-Conductive Polymer-Based Hybrid Film Interconnections for Stretchable Electronic Devices

Table 2

Comparison of morphology change of Au under various plasma conditions.

Metal (50 nm)	Process	Duration	AFM surface	Roughness
Au	No plasma	Nil	Rq: 11.6 nm	Rq: 7.65 nm
			Ra: 9.5 nm	Ra: 3.02 nm
Au	O2 plasma	10 seconds	Rq: 10.7 nm	Rq: 11.4 nm
			Ra: 8.9 nm	Ra: 10.11 nm
Au	O2 plasma	20 seconds	Rq: 2.21 nm	Rq: 6.52 nm
			Ra: 1.75 nm	Ra: 6.12 nm
Au	O2 plasma	30 seconds	Rq: 1.42 nm	Rq: 4.42 nm
			Ra: 0.98 nm	Ra: 6.78 nm