Pulse Electrodeposition of Palladium Nanoparticles onto Silicon in DMSO

Table 1

Conditions for the formation of noble metal nanoparticles on the silicon surface by electrodeposition method.

Metal	Type of silicon	The composition of the solution	Condition of deposition		Metal sediments	Ref.
			icathode	E
Ag	n-Si(643)	Commercial cyanide-based silver plating solution (KROHN)	10 mA/cm^2	—	Epitaxial film	[9]
	n-Si(111)	5 mM AgCN, 0.2 M KCN, 0.5 M KOH	—	−0.80…−0.90 V vs. SHE	100…300 nm particles	[11]
	Microporous p-Si(100)	0.1 M AgNO3 + 0.5 M KNO3	6.4 μA/cm^2	—	Deposit in silicon pores	[12]
Au	n-Si(643)	0.1 mM HAuCl4, 1 mM KCl, 1 mM H2SO4, 100 mM K2SO4	—	−1.9 V vs. Ag/AgCl	Epitaxial film	[9]
	p-type Si wafers(100)	(0.1 or 0.01 M)HAuCl4 in 0.5 M NaCl or 0.5 M Na2SO4	—	0 V vs. Ag/AgCl	Deposit in silicon pores	[13]
	n-Si (100)	(2, 50 mM) KAu(CN)2 + (0.2, 1.0 M) KCN	—	(−1.2…−1, 7) V vs. Ag/AgCl	Hemispherical clusters	[14]
	n-Si(100)	Neutronex® 309 Au solution, a sulfite-based Au chemistry + thallium(I) acetate	1, 5, 10 mA/cm^2	−1.1 V vs. SCE	Particles ∅ 30…200 nm	[15]
	H–Si(111)	(1) 10^−4 M HAuCl4 + 0.1 M K2SO4; (2) 10^−4 M KAu(CN)2 + 2·10^−4 M NaCN + 2 M NaOH	—	−2.0 V	Islands 4…30 nm	[16]
	n-Si(100)	Sulphite/thiosulphate electrolytic baths	Constant potential, constant current, cyclic voltammetry and pulsating overpotential		Bulk deposits	[17]
	p-Si(100)	1 mM KAu(CN)2 + 0.25 M K2CO3	—	−1.0…−1.4 V vs. Ag/AgCl	Particles ∅ <100 nm	[18]
Pt	n-Si(643)	0.5 M NaCl, 3 mM K2PtCl4; pH = 4	—	−0.58 V vs. Ag/AgCl	Epitaxial film	[9]
	p-Si(100)	(0.1 or 0.01 M)H2PtCl6 in 0.5 M NaCl or 0.5 M Na2SO4	—	−0.4 or −0.8 V vs. Ag/AgCl	Deposit in silicon pores	[13]
	Microporous p-Si(100)	0.1 M K2PtCl4 + 0.5 M NaCl	6.4 μA/cm^2	—	Deposit in silicon pores	[12]
	p-Si(100)	10^−2 M Na2PtCl6 + 0.5 M H2SO4	—	CVA between −300 and 100 mV	100…300 nm particles	[19]
	n-Si(1 1 1):H	1 mM H2PtCl6 + 0.1 M K2SO4	—	−0.35 V vs. Ag/AgCl	Nanofilms, nanoparticles	[20]
	n-Si(100) p-Si(100)	(0.03…2.5)mM PtCl4^2− + 2 M HF	(0.035…0.15) mA/cm^2	—	Islands <100 nm	[21]
	Pt/SiNWs array	1 g/L H2PtCl6, pH = 2.0 (by HCl)	Pulse electrodeposition (−0.35 V vs. Ag/AgCl): τoff/τoff = 25/100 ms		Flower-like Pt-nanoclusters	[22]
Pd	p-Si (100)	(0.1 or 0.01 M)PdCl2 + 0.2 M HCl + 1.0 M NaCl or 0.5 M Na2SO4	—	−0.4 or −0.8 V vs. Ag/AgCl	Deposit in silicon pores	[13]
	Microporous p-Si (100)	0.1 M PdCl2 + 0.2 M HCl + 0.5 M NaCl	10 mA/cm^2	−0.4 V vs. Ag/AgCl	Deposit in silicon pores	[23]
	Scratches on p-Si (100)	0.01 g/l PdCl2 + 0.1 M HCl	—	0.0, 0.2, 0.4 V vs. Ag/AgCl	Sub-100 nm lines	[24]
Ru	n-Si(100)	4 mM RuCl3 in BMIPF6	—	−1.4…−2.0 V vs. Pt/Pt(II)	∼100 nm films	[25]
	p-Si (100), p-Si (111), n-Si (100)	0.16 mM K2RuCl5 + 0.18 M H2SO4	1…20 mA/cm^2	vs. Ag/AgCl	∅ 20−30 nm hemispherical shape	[26]
Ir	n-Si(111)	10 mM IrCl3 + 0.5 M KCl + 5% isopropanol. pH = 2.2	—	−0.9 V SCE	5–10 nm nanoislands	[27]
Re	p-Si(100)	10 mM NH4ReO4, pH = 2 (H2SO4)	CV (between 0.50 and 0.65 V)		Nanofilm	[28]