Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology

<div>EDS-mapping of the GA before loading Au (III) (a, b) and after loading Au (III) (c, d) on it.</div>

Journal of Chemistry

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Figure 3: Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology 

Figure 3 | Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology 