Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology

<div>Contour plots and three-dimensional response surfaces of Au (III) adsorption via the GA representing interactions between different variables: (a) pH and adsorbent mass, (b) Au (III) concentration and pH, (c) contact time and pH, (d) Au (III) concentration and adsorbent mass, (e) contact time and adsorbent mass, and (f) contact time and Au (III) concentration.</div>

Journal of Chemistry

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Figure 4: Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology 

Figure 4 | Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology 