Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology

<table class="table-group" id="tab2"><tr><td><table class="table"><tr><td class="thead-hr" colspan="4"><hr/></td></tr><tr class="thead"><td class="align_left">Composition</td><td class="align_center">% C</td><td class="align_center">% H</td><td class="align_center">% N</td></tr><tr><td class="thead-hr" colspan="4"><hr/></td></tr><tr><td class="align_left">GA</td><td class="align_center">47.49</td><td class="align_center">4.91</td><td class="align_center">1.17</td></tr><tr class="table-tr"><td colspan="4"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>CHN elemental analysis report of GA composition.</div>

Journal of Chemistry

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Table 2

Table 2: Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology 

Table 2 | Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology 