Research Article

Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology

Table 3

Comparison of adsorption capacities, time required, and temperature to reach the equilibrium of several adsorbents for Au (III).

AdsorbentsQmIsothermKineticpHT ()Time (h)Reference

DACS-TA298.5LangmuirPSO233322[53]
Asn@SBA-15307LangmuirPSO2.093032.5[55]
UHMWPE-g-PAO220Freundlich3298[60]
PANF-ATL130.58LangmuirPSO0.1 M HCl2984[63]
CFP-g-PHCTMA137.6PSO0.1 M HCl2983[72]
AIAC191.92LangmuirPSO129824[73]
3, 4-DHB-MCM-412905298[74]
D301-g-THIOPGMA300.4LangmuirPFO22985[75]
D301-g-EDAPGMA274.7LangmuirPFO22985[75]
Graphene oxide108.342LangmuirPSO62986[76]
PPF resin5060.58 M HCl30324[77]
GO159.34LangmuirPFO and PSO112981[78]
GO171.23Langmuir11308[78]
Au-C-PTS140.54LangmuirPSO53033[79]
GA315.450FreundlichPSO23030.5This work