Fast and Selective Adsorption of Au (III) from the Waste Printed Circuit Boards Using a Low-Cost Adsorbent: Optimization by Central Composite Design Based on Response Surface Methodology

Table 4

Comparison of adsorbent mass and the number of competing metals of several adsorbents for gold adsorption.

Adsorbents	Adsorbent mass (mg)	Competing metals	Reference
DACS-TA	50	Cr, Fe, Al, Sb, Cu, Ni, and Zn	[53]
AS–5BA	50	Fe, Cu, and Zn	[57]
BHJC	20	Hg, Cu, Pb, Ni, Zn, Cd, Cr, and Co	[58]
PANF-ATL	15	Ni, Cd, Cu, Zn, and Pb	[63]
DTGA–XAD16	30	Cr, Ni, Ba, Sn, Fe, Se, Zn, Pb, Cu, As, and Y	[68]
D301-g-EDAPGMA	10	Cu and Zn	[75]
Au-C-PTS	100	Hg, Cu, Cd, and Fe	[79]
GA	23	Ag, Al, Si, Zn, Pb, Ba, Ni, Ca, Mo, Co, Cr, Mn, Cu, Mg, Fe, and W	This work