Physical, Microbial, and Chemical Quality of Hot-Air-Dried Persimmon (Diospyros kaki) Chips during Storage
Table 3
Instrumental texture variables.
Texture analysis type
Variable
Preparation
2–5
6–10
Texture profile analysis (TPA)
Hardness1 (N)
36.02 ± 1.57
108.02 ± 2.86
Energy1 (N·mm)
3.27 ± 0.19
24.92 ± 0.85
Hardness2 (N)
33.00 ± 1.49
89.85 ± 2.77
Energy2 (N·mm)
2.17 ± 0.13
14.02 ± 0.66
Cohesiveness ( )
0.666 ± 0.016
0.561 ± 0.014
Springiness ( )
0.730 ± 0.011
0.656 ± 0.012
Chewiness (N)
17.90 ± 0.94
41.36 ± 2.26
Resilience ( )
0.731 ± 0.022
0.448 ± 0.016
Shear
MaxLoad (N)
26.66 ± 1.19
51.79 ± 1.38
Toughness (N·mm)
37.47 ± 2.69
107.18 ± 3.48
PeakCount ( )
6.49 ± 0.48
9.54 ± 0.93
Listed values are mean (for all tested time points) ± 1 standard error from the mean. Significant difference between preparations at ; significant difference between preparations at . ( ) = unitless.
