Dynamic Deposition of Nanocopper Film on the β-SiC_p Surface by Magnetron Sputtering

Table 2

The copper size and proportion of copper on the SiC_p surface under different sputtering conditions.

Specimen	Mass fraction of Cu, %	Grain size (nm)
S1	0.32%	29.86
S2	1.16%	31.08
S3	2.20%	34.37
S4	0.79%	33.42
S5	2.05%	43.80
S6	0.60%	28.37
S7	1.61%	38.08