Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment

Figure 11

SEM fracture surfaces of the joints bonded using solder Pb95Sn5 after heat treatment at different temperatures for 50 hours: 200°C (a), 250°C (b), 300°C (c), and 350°C (d).

(a)

(b)

(c)

(d)