Design, Simulation, and Analysis of Micro/Nanoelectromechanical System Rotational Devices

Table 1

Parameters used.

Sl. No.	Parameters	Values
1.	Coefficient of thermal expansion of polysilicon (α)
2.	Electrical specific resistance of polysilicon at room temperature ()
3.	Thermal conductivity of polysilicon ()	32 W-m^-1-K^-1
4.	Thermal conductivity of air ()	0.006 W-m^-1-K^-1
5.	Thermal conductivity of silicon()	2.25 W-m^-1-K^-1
6.	Thickness of polysilicon ()	2000 nm
7.	Thickness of air ()	2000 nm
8.	Thickness ()	2000 nm
9.	Thickness of silicon ()	2000 nm