A Fast Postprocessing Algorithm for the Overlapping Problem in Wafer Map Detection

Figure 3

Basic types of wafer maps. (a–f) and mixed defect types (g–l). (a) “Center”; (b) “EdgeLoc”; (c) “Loc”; (d) “Donut”; (e) “Scratch”; (f) “EdgeRing”; (g) “Loc”+“Scratch”; (h) “Donut”+“Loc”+“EdgeLoc”; (i) “Center”+“EdgeLoc”+“Scratch”+“Loc”; (j) “Loc”+“EdgeLoc”+“Scratch”; (k) “Loc”+“Scratch”; (l) “Loc”+“Scratch”.

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