Research on “Cylinder-Four-Beam” Microstructure Improvement of MEMS Bionic Vector Hydrophone

<table class="figure-group"><tr class="fig-image" id="a"><td><object data="https://static-preview.hindawi.com/articles/js/volume-2021/5580390/figures/5580390.fig.0016a.svgz" name="5580390.fig.0016a" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(a) </b>SOI</td></tr><tr class="fig-image" id="b"><td><object data="https://static-preview.hindawi.com/articles/js/volume-2021/5580390/figures/5580390.fig.0016b.svgz" name="5580390.fig.0016b" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(b) </b>Pizeoresistor</td></tr><tr class="fig-image" id="c"><td><object data="https://static-preview.hindawi.com/articles/js/volume-2021/5580390/figures/5580390.fig.0016c.svgz" name="5580390.fig.0016c" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(c) </b>Ohmic contact</td></tr><tr class="fig-image" id="d"><td><object data="https://static-preview.hindawi.com/articles/js/volume-2021/5580390/figures/5580390.fig.0016d.svgz" name="5580390.fig.0016d" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(d) </b>Etching back substrate</td></tr><tr class="fig-image" id="e"><td><object data="https://static-preview.hindawi.com/articles/js/volume-2021/5580390/figures/5580390.fig.0016e.svgz" name="5580390.fig.0016e" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(e) </b>Metal wire</td></tr><tr class="fig-image" id="f"><td><object data="https://static-preview.hindawi.com/articles/js/volume-2021/5580390/figures/5580390.fig.0016f.svgz" name="5580390.fig.0016f" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(f) </b>Four-beam structure</td></tr></table>

<div>The processing technology of the optimized four-beam microstructure.</div>

Journal of Sensors

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Figure 16

Figure 16: Research on “Cylinder-Four-Beam” Microstructure Improvement of MEMS Bionic Vector Hydrophone 