Qualitative Simulation of the Growth of Electrolessly Deposited Cu Thin Films

Figure 2

The growth of Cu particles using parameter values in (3.1) at (a) 𝑡=2, (b) 𝑡=10, and (c) 𝑡=18. (d) The in-plane growth and out-plane growth over the plating time.

(a)

(b)

(c)

(d)